Design Rules for HDI Multilayer PCB’s
ITEM | STANDARD INDUSTRIAL |
ADVANCED INDUSTRIAL |
SPACE, DEFENSE & AEROSPACE |
|
Default Standard | IPC CLASS 2 | IPC CLASS 2 | IPC CLASS 3 / 3A | |
Layer count | Upto 24 ayers | Upto 34 layers | Upto 24 layers | |
Materials | Complete range as per materials list |
Complete range as per materials list |
Complete range as per materials list |
|
Core / Foil construction | Default foil, core on special applications | Default foil, core on special applications | Default foil, core on special applications | |
Inner layer Line Width / Spacing | 89 / 89 microns | 76 / 76 microns | 89 / 89 microns | |
Minimum Inner layer Base copper start | 18 microns | 18 microns | 18 microns | |
Maximum Inner layer Base copper start | 70 microns | 70 microns | 70 microns | |
Outer layer Line Width / Spacing | 89 / 89 microns without Cap plating , 125/125 microns with Cap plating | 89 / 89 microns without Cap plating , 100/100 microns with Cap plating | 89 / 89 microns without Cap plating , 100/100 microns with Cap plating | |
Minimum Outer layer Base copper start | 12 microns | 9 microns | 12 microns | |
Maximum Outer layer Base copper start | 18 microns | 18 microns | 18 microns | |
Thinnest core (Rigid High Tg 170 FR4) – excluding copper foil |
0.1 mm | 0.1 mm | 0.1 mm | |
Minimum laser Hole Diameter / Minimum pad size /PCB thickness |
0.1/0.25 landing pad/ 100 microns dielectric separation maximum |
0.1/0.20 landing pad/ 100 microns dielectric separation maximum |
0.1/0.30 landing pad/ 100 microns dielectric separation maximum |
|
Minimum Mechanical Hole Diameter / Minimum pad size /PCB thickness |
0.15/0.45/ 1.6 mm |
0.15/0.45/ 1.6 mm |
0.20/0.61/2.4 mm | |
Mechanical blind and buried drills | Offered / contact Hi-Q stackup team |
Offered / contact Hi-Q stackup team |
Offered / contact Hi-Q stackup team |
|
Solder Mask pad size enlarged with respect to copper pad |
0.051 mm | 0.026 mm | 0.051 mm | |
Solder mask color | Green, Blue, Red Teal |
Green, Blue, Red, Teal |
Green, Other Mask upon request | |
Surface Finish | ENIG/ Silver/ Leaded HASL Hard Gold |
ENIG/ Silver/ Leaded HASL Hard Gold |
ENIG/ Silver/ Leaded HASL Hard Gold |
|
Controlled Impedance | YES +/- 10% TDR Measured | YES +/- 10% TDR Measured | YES +/- 10% TDR Measured | |
Legend | White | White | White | |
Automated Serial # printing | Optional | Optional | Yes | |
Back Drilling – tolerance | 0.4 mm from landing layer | 0.4 mm from landing layer | 0.4 mm from landing layer | |
BBT Testing | Flying probe tested against Netlist |
Flying probe tested against Netlist |
Flying probe tested against Netlist |
|
Via filling | Type VI | Type VI | Type IV and Type VI | |
Via filling with Cap plating including via on pad | Type VII | Type VII | Type VII | |
Via filling with copper including via on pad | Laser holes only | Laser holes only | Laser holes only | |
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