Design Rules for HDI Multilayer PCB’s
| ITEM | STANDARD INDUSTRIAL |
ADVANCED INDUSTRIAL |
SPACE, DEFENSE & AEROSPACE |
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| Default Standard | IPC CLASS 2 | IPC CLASS 2 | IPC CLASS 3 / 3A | |
| Layer count | Upto 24 ayers | Upto 34 layers | Upto 24 layers | |
| Materials | Complete range as per materials list |
Complete range as per materials list |
Complete range as per materials list |
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| Core / Foil construction | Default foil, core on special applications | Default foil, core on special applications | Default foil, core on special applications | |
| Inner layer Line Width / Spacing | 89 / 89 microns | 76 / 76 microns | 89 / 89 microns | |
| Minimum Inner layer Base copper start | 18 microns | 18 microns | 18 microns | |
| Maximum Inner layer Base copper start | 70 microns | 70 microns | 70 microns | |
| Outer layer Line Width / Spacing | 89 / 89 microns without Cap plating , 125/125 microns with Cap plating | 89 / 89 microns without Cap plating , 100/100 microns with Cap plating | 89 / 89 microns without Cap plating , 100/100 microns with Cap plating | |
| Minimum Outer layer Base copper start | 12 microns | 9 microns | 12 microns | |
| Maximum Outer layer Base copper start | 18 microns | 18 microns | 18 microns | |
| Thinnest core (Rigid High Tg 170 FR4) – excluding copper foil |
0.1 mm | 0.1 mm | 0.1 mm | |
| Minimum laser Hole Diameter / Minimum pad size /PCB thickness |
0.1/0.25 landing pad/ 100 microns dielectric separation maximum |
0.1/0.20 landing pad/ 100 microns dielectric separation maximum |
0.1/0.30 landing pad/ 100 microns dielectric separation maximum |
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| Minimum Mechanical Hole Diameter / Minimum pad size /PCB thickness |
0.15/0.45/ 1.6 mm |
0.15/0.45/ 1.6 mm |
0.20/0.61/2.4 mm | |
| Mechanical blind and buried drills | Offered / contact Hi-Q stackup team |
Offered / contact Hi-Q stackup team |
Offered / contact Hi-Q stackup team |
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| Solder Mask pad size enlarged with respect to copper pad |
0.051 mm | 0.026 mm | 0.051 mm | |
| Solder mask color | Green, Blue, Red Teal |
Green, Blue, Red, Teal |
Green, Other Mask upon request | |
| Surface Finish | ENIG/ Silver/ Leaded HASL Hard Gold |
ENIG/ Silver/ Leaded HASL Hard Gold |
ENIG/ Silver/ Leaded HASL Hard Gold |
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| Controlled Impedance | YES +/- 10% TDR Measured | YES +/- 10% TDR Measured | YES +/- 10% TDR Measured | |
| Legend | White | White | White | |
| Automated Serial # printing | Optional | Optional | Yes | |
| Back Drilling – tolerance | 0.4 mm from landing layer | 0.4 mm from landing layer | 0.4 mm from landing layer | |
| BBT Testing | Flying probe tested against Netlist |
Flying probe tested against Netlist |
Flying probe tested against Netlist |
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| Via filling | Type VI | Type VI | Type IV and Type VI | |
| Via filling with Cap plating including via on pad | Type VII | Type VII | Type VII | |
| Via filling with copper including via on pad | Laser holes only | Laser holes only | Laser holes only | |
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